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This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry acronyms.

Product Details

Published:

06/01/2013

Number of Pages:

132

File Size:

1 file , 6.3 MB