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JIS Z 3285:2017 specifies the characteristics test methods for solder paste using fine solder particles with a particle size of symbol 7 and symbol 8 specified in JIS Z 3284-1 (hereafter referred to as solder paste), mainly intended for connection of wiring and components to high-density printed circuit boards with fine wiring (e.g. 60 µm or smaller in minimum conductor width and minimum conductor spacing) used in electronic and communication devices. The test methods specified in this Standard incorporate consideration for the effect of high surface activity of fine solder particles, so that such solder particles can be tested with better precision than when tested using the test methods specified in JIS Z 3284 series.

Product Details

Published:

01/01/2017

Number of Pages:

26

File Size:

1 file , 1.3 MB