User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
standard by Association Connecting Electronics Industries, 12/01/2010

Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/2000

Definition for Web-Based Exchange of XML Data
standard by Association Connecting Electronics Industries, 07/01/2003

Surface Mount Placement Equipment Characterization
standard by Association Connecting Electronics Industries, 07/01/2002

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards with Amendments 1 and 2
standard by Association Connecting Electronics Industries, 12/01/2012

Surface Mount Air Force Mantech Artwork
standard by Association Connecting Electronics Industries,

Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 04/01/2010

Design and Assembly Process Implementation for Flip Chip and Die Size Components
standard by Association Connecting Electronics Industries, 02/01/2009

Polymer Thick Film Artwork
standard by Association Connecting Electronics Industries,

Supply Chain Social Responsibility Management System Guidance
standard by Association Connecting Electronics Industries, 03/01/2017

Sectional Design Standard for High Density Interconnect (HDI) Boards
standard by Association Connecting Electronics Industries, 05/01/2003

Troubleshooting for Printed Board Fabrication Processes
standard by Association Connecting Electronics Industries, 02/01/2016