Technology Reference for Design Manual
Handbook / Manual / Guide by Association Connecting Electronics Industries,

Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 02/01/2005

Implementation of Ball Grid Array and Other High Density Technology
standard by Association Connecting Electronics Industries, 08/01/1996

Statistical Process Control (SPC) Quality Rating
standard by Association Connecting Electronics Industries, 09/01/2002

Design and End Product Requirements for Discrete Wiring Boards
standard by Association Connecting Electronics Industries, 05/01/1995

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
standard by Association Connecting Electronics Industries, 08/01/2014

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
standard by Association Connecting Electronics Industries, 02/01/2003

2000 Technology Trends for Printed Wiring Boards
Report / Survey by Association Connecting Electronics Industries, 01/01/2000

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
standard by Association Connecting Electronics Industries, 07/01/2001

Documentation Requirements for Printed Boards
standard by Association Connecting Electronics Industries, 05/01/1995

Telecom Addendum to IPC-A-610 Revision G Acceptability of Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 10/01/2019

Requirements for Soldered Electrical and Electronic Assemblies with Amendment 1
standard by Association Connecting Electronics Industries, 04/01/2016