Specifications for Base Materials for Rigid and Multilayer Printed Boards (Includes Amendment 1)
standard by Association Connecting Electronics Industries, 06/01/2002

Environmental Best Practices Guide
standard by Association Connecting Electronics Industries,

Printed Wiring Board Strain Gage Test Guideline
standard by Association Connecting Electronics Industries, 06/01/2005

Telecom Addendum to IPC-A-610 Revision G Acceptability of Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 10/01/2019

Acceptability of Printed Boards
standard by Association Connecting Electronics Industries, 05/01/2016

Design Guide for High Density Interconnects & Microvias
Handbook / Manual / Guide by Association Connecting Electronics Industries, 06/01/2000

Specification for Base Materials for High Speed/High Frequency Applications
standard by Association Connecting Electronics Industries, 11/01/2017

Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
standard by Association Connecting Electronics Industries, 05/01/2002

Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
standard by Association Connecting Electronics Industries, 12/01/2018

Automotive Applications Addendum to IPC-6012D, Qualficiation and Performance Specification for Rigid Printed Boards
Amendment by Association Connecting Electronics Industries, 04/01/2016

Microwave End Product Board Inspection and Test
standard by Association Connecting Electronics Industries, 11/01/2011

Printed Board Automated Assembly Description in Digital Form
standard by Association Connecting Electronics Industries, 01/01/1995