Sectional Standard on Rigid PWB Design
standard by Association Connecting Electronics Industries, 03/01/1998

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards, includes Amendment 1 and 2
standard by Association Connecting Electronics Industries, 10/01/2002

Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
Handbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/1996

Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2016

Sectional Design Standard for Flexible Printed Boards
standard by Association Connecting Electronics Industries, 11/01/2011

Accelerated Aging for Solderability Evaluations
standard by Association Connecting Electronics Industries, 12/01/1987

Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 01/01/2017

Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendment 1
standard by Association Connecting Electronics Industries, 07/01/2015

Dimensional Stability Testing of Thin Laminates-Report on Phase I and Phase II International Round Robin Test Programs – Includes addenda I and II
standard by Association Connecting Electronics Industries, 03/01/1991

Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
standard by Association Connecting Electronics Industries, 03/01/2018

Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 10/31/2017

User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
standard by Association Connecting Electronics Industries, 06/01/2016