Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 10/31/2017

User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
standard by Association Connecting Electronics Industries, 06/01/2016

Guidelines for Cleaning of Printed Boards and Assemblies
Handbook / Manual / Guide by Association Connecting Electronics Industries, 07/01/2011

Qualification and Performance Specification for Flexible Printed Boards
standard by Association Connecting Electronics Industries, 01/01/2009

Requirements and Acceptance for Cable and Wire Harness Assemblies with Amendment 1
standard by Association Connecting Electronics Industries, 10/01/2012

Acceptability of Printed Boards
standard by Association Connecting Electronics Industries, 07/01/2004

Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1
standard by Association Connecting Electronics Industries, 09/01/2017

The Global Standard for Machine-to-Machine Communication in SMT Assembly
standard by Association Connecting Electronics Industries, 06/01/2019

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
standard by Association Connecting Electronics Industries, 06/01/2013

Design and Assembly Process Implementation for BGAs
standard by Association Connecting Electronics Industries, 03/01/2008

Press-fit Standard for Automotive Requirements and other High-Reliability Applications
standard by Association Connecting Electronics Industries, 05/01/2020

Specification for Immersion Tin Plating for Printed Circuit Boards with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2012