HDIS 1998 Conference Proceedings
Conference Proceeding by Association Connecting Electronics Industries, 01/01/1998

Final Acceptance Criteria Standard for PV Modules-Final Module Assembly
standard by Association Connecting Electronics Industries, 06/01/2014

Generic Standard on Printed Board Design
standard by Association Connecting Electronics Industries, 11/01/2012

Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication (CAMX)
standard by Association Connecting Electronics Industries, 10/01/2001

Guide to Solder Paste Assessment
Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/2006

Design and Assembly Process Implementation of 3D Components
standard by Association Connecting Electronics Industries, 06/01/2017

Printed Board Description in Digital Form
standard by Association Connecting Electronics Industries, 07/01/1992

Troubleshooting Guide for Printed Board Manufacture and Assembly
standard by Association Connecting Electronics Industries, 12/01/1997

User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)
standard by Association Connecting Electronics Industries,

Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
standard by Association Connecting Electronics Industries, 09/01/2005

TMRC Technology Trends for Rigid Printed Wiring Boards
Report / Survey by Association Connecting Electronics Industries, 06/27/2000

Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards
standard by Association Connecting Electronics Industries, 01/01/2000