Requirements for Soldering Fluxes – includes Amendment 1
standard by Association Connecting Electronics Industries, 12/01/2008

Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 04/01/2010

Requirements for Electrical Testing of Unpopulated Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2016

Qualification and Performance Specification for Rigid Printed Boards
standard by Association Connecting Electronics Industries, 02/01/2020

Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
standard by Association Connecting Electronics Industries, 01/01/2018

Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards
standard by Association Connecting Electronics Industries, 01/01/2000

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/01/2002

Specification for Base Materials for High Speed/High Frequency Applications
standard by Association Connecting Electronics Industries, 01/01/2002

Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 07/01/2008

Standards for Surface Mount Assemblies Manual
standard by Association Connecting Electronics Industries,

Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/1995

Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
standard by Association Connecting Electronics Industries, 09/01/2013