IPC APEX 2019 Technical Conference Proceedings
Conference Proceeding by Association Connecting Electronics Industries, 04/11/2019
Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components
standard by Association Connecting Electronics Industries, 07/01/1993
Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes
standard by Association Connecting Electronics Industries, 10/01/2016
Results of Multilayer Test Program Round Robin
standard by Association Connecting Electronics Industries, 04/01/1981
Design and Assembly Process Implementation for BGAs, with Amendment 1
standard by Association Connecting Electronics Industries, 06/01/2019
Acceptability of Printed Boards
standard by Association Connecting Electronics Industries, 07/09/2020
Technical Proceedings for the Designers Learning Symposium – 2001
Conference Proceeding by Association Connecting Electronics Industries, 07/18/2001
Time, Temperature and Humidity Stress of Final Board Finish Solderability
standard by Association Connecting Electronics Industries, 05/01/2006
Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2014