Guidelines for Design, Selection and Application of Conformal Coatings
Handbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/2013

Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
standard by Association Connecting Electronics Industries, 01/01/2018

Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1
standard by Association Connecting Electronics Industries, 08/01/2004

Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
standard by Association Connecting Electronics Industries, 01/01/2013

Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 06/01/2013

IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies (Correcting the Misunderstandings on "Halogen-Free")
standard by Association Connecting Electronics Industries, 08/01/2007

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 10/01/2013

Specification for Multilayer Hybrid Circuits
standard by Association Connecting Electronics Industries, 01/10/1987

Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline
standard by Association Connecting Electronics Industries, 09/01/2004

Generic Requirements for Surface Mount Land Pattern and Design Standard – INCLUDES LAND PATTERN VIEWER SOFTWARE
standard by Association Connecting Electronics Industries,

General Guidelines for Implementation of Statistical Process Control (SPC)
standard by Association Connecting Electronics Industries, 11/01/1999

Performance Standard fo Construction of Flip Chip and Chip Scale Bumps
standard by Association Connecting Electronics Industries, 04/01/1999