IPC Phase 3 Controlled Atmosphere Soldering Study
standard by Association Connecting Electronics Industries, 08/01/1994

Trusted Electronic Designer, Fabricator and Assembler Requirements
standard by Association Connecting Electronics Industries, 01/01/2020

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/31/2012

Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
standard by Association Connecting Electronics Industries, 05/01/1998

Connected Factory Exchange (CFX)
standard by Association Connecting Electronics Industries, 03/01/2019

General Guidelines for Implementation of Statistical Process Control (SPC)
standard by Association Connecting Electronics Industries, 11/01/1999

Performance Standard fo Construction of Flip Chip and Chip Scale Bumps
standard by Association Connecting Electronics Industries, 04/01/1999

Design and Critical Process Requirements for Cable and Wiring Harnesses
standard by Association Connecting Electronics Industries, 12/01/2015

Multipurpose 1 & 2 Sided Test Pattern – Gerber Format
standard by Association Connecting Electronics Industries,

Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 07/01/2014

Component Packaging and Interconnecting with Emphasis on Surface Mounting
standard by Association Connecting Electronics Industries, 03/01/1988

Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
standard by Association Connecting Electronics Industries, 07/01/2017