Performance Standard fo Construction of Flip Chip and Chip Scale Bumps
standard by Association Connecting Electronics Industries, 04/01/1999
Multipurpose 1 & 2 Sided Test Pattern – Gerber Format
standard by Association Connecting Electronics Industries,
Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B
Handbook / Manual / Guide by Association Connecting Electronics Industries, 02/01/2012
IPC Phase 3 Controlled Atmosphere Soldering Study
standard by Association Connecting Electronics Industries, 08/01/1994
Component Identification for Through Hole and Surface Mount
Training Material by Association Connecting Electronics Industries, 07/01/2002
Selection and Application of Board Level Underfill Materials
standard by Association Connecting Electronics Industries, 02/01/2014