Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
standard by Association Connecting Electronics Industries, 03/01/2017

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
standard by Association Connecting Electronics Industries, 12/01/2016

Reflow Oven Process Control Standard
standard by Association Connecting Electronics Industries, 03/01/2015

Rework, Modification and Repair of Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/2017

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2018

Small Hole Reliability Round Robin Artwork
standard by Association Connecting Electronics Industries, 09/01/1988

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 05/01/2006

Multipurpose 1 Sided Test Pattern – Gerber Format
standard by Association Connecting Electronics Industries,

Specifications for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 12/10/1997

TM-650 – Test Methods Manual
standard by Association Connecting Electronics Industries,

Intellectual Property Protection in Printed Board Manufacturing
standard by Association Connecting Electronics Industries, 04/01/2016

Standards for Printed Board Materials Manual
standard by Association Connecting Electronics Industries,