Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2017

Requirements for Printed Electronics Base Materials (Substrates)
standard by Association Connecting Electronics Industries, 05/01/2017

Book by Association Connecting Electronics Industries, 04/07/2000

Chip Scale and BGA National Symposium Proceedings 1999
Conference Proceeding by Association Connecting Electronics Industries, 05/01/1999

Design and Assembly Process Implementation for Embedded Components
standard by Association Connecting Electronics Industries, 02/01/2015

Implementation of Flip Chip and Chip Scale Technology
standard by Association Connecting Electronics Industries, 01/01/1996

Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 02/02/2020

Guidelines for Chip-on-Board Technology Implementation
standard by Association Connecting Electronics Industries, 11/01/1990

Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
standard by Association Connecting Electronics Industries, 11/01/2013

Guidelines for Phototool Generation and Measurement Techniques
Handbook / Manual / Guide by Association Connecting Electronics Industries, 06/01/1991

Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
standard by Association Connecting Electronics Industries, 07/01/2012

Rework of Electronic Assemblies & Repair and Modification of Printed Boards and Electronic Assemblies
standard by Association Connecting Electronics Industries, 04/01/1998