Mechanical Shock – Component and Subassembly
standard by JEDEC Solid State Technology Association, 07/01/2013
DEFINITION OF THE SSTU32S869 & SSTU32D869 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 04/01/2007
POD135 – 1.35 V PSEUDO OPEN DRAIN I/O
standard by JEDEC Solid State Technology Association, 07/01/2010
Inspection Criteria for Microelectronic Packages and Covers
standard by JEDEC Solid State Technology Association, 05/01/2017
WIRE BOND SHEAR TEST
standard by JEDEC Solid State Technology Association, 08/01/2009
RECOMMENDED ESD TARGET LEVELS FOR HBM QUALIFICATION
standard by JEDEC Solid State Technology Association, 07/01/2018
GDDR5 Measurement Procedures
standard by JEDEC Solid State Technology Association, 2014
ADDENDUM No. 2 to JESD35 – TEST CRITERIA FOR THE WAFER-LEVEL TESTING OF THIN DIELECTRICS
standard by JEDEC Solid State Technology Association, 02/01/1996
DDR4 SDRAM Standard
standard by JEDEC Solid State Technology Association, 09/01/2012
STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE MECHANISMS ASSOCIATED WITH ASSEMBLED SOLID STATE SURFACE-MOUNT COMPONENTS
standard by JEDEC Solid State Technology Association, 05/01/2005
HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST)
standard by JEDEC Solid State Technology Association, 11/01/2010
HERMETICITY
standard by JEDEC Solid State Technology Association, 07/01/2001