STANDARD METHOD FOR MEASURING AND USING THE TEMPERATURE COEFFICIENT OF RESISTANCE TO DETERMINE THE TEMPERATURE OF A METALLIZATION LINE
standard by JEDEC Solid State Technology Association, 02/01/2004

SERIAL FLASH DISCOVERABLE PARAMETERS (SFDP)
standard by JEDEC Solid State Technology Association, 07/01/2013

THERMAL TEST ENVIRONMENT MODIFICATIONS FOR MULTICHIP PACKAGES
standard by JEDEC Solid State Technology Association, 07/01/2008

TEMPERATURE, BIAS, AND OPERATING LIFE
standard by JEDEC Solid State Technology Association, 07/01/2017

SUGGESTED PRODUCT-DOCUMENTATION, CLASSIFICATIONS, AND DISCLAIMERS
standard by JEDEC Solid State Technology Association, 07/01/1996

STANDARD FOR DESCRIPTION OF LOW VOLTAGE TTL-COMPATIBLE CMOS LOGIC DEVICES
standard by JEDEC Solid State Technology Association, 11/01/1995

GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID / MCM PRODUCTS
standard by JEDEC Solid State Technology Association, 05/01/2002

JOINT IPC/JEDEC STANDARD FOR ACOUSTIC MICROSCOPY FOR NONHERMETRIC ENCAPSULATED ELECTRONIC COMPONENTS
standard by JEDEC Solid State Technology Association, 05/01/1999

1.2 V High-Speed LVCMOS (HS_LVCMOS) Interface
standard by JEDEC Solid State Technology Association, 09/01/2011

TEST METHODS AND ACCEPTANCE PROCEDURES FOR THE EVALUATION OF POLYMERIC MATERIALS
standard by JEDEC Solid State Technology Association, 03/01/2018

FOUNDRY PROCESS QUALIFICATION GUIDELINES – BACKEND OF LINE (Wafer Fabrication Manufacturing Sites)
standard by JEDEC Solid State Technology Association, 09/01/2018

THERMAL MODELING OVERVIEW
standard by JEDEC Solid State Technology Association, 10/01/2008