EXTENSION OF THERMAL TEST BOARD STANDARDS FOR PACKAGES WITH DIRECT THERMAL ATTACHMENT MECHANISMS
standard by JEDEC Solid State Technology Association, 02/01/1999

STANDARD FOR THE MEASUREMENT OF CRE
standard by JEDEC Solid State Technology Association, 11/01/1967

POWER MOSFET ELECTRICAL DOSE RATE TEST METHOD
standard by JEDEC Solid State Technology Association, 08/01/1989

ADDENDUM No. 3A to JESD8 – GUNNING TRANSCEIVER LOGIC (GTL) LOW-LEVEL, HIGH-SPEED INTERFACE STANDARD FOR DIGITAL INTEGRATED CIRCUITS
standard by JEDEC Solid State Technology Association, 05/01/2007

STANDARD METHOD FOR MEASURING AND USING THE TEMPERATURE COEFFICIENT OF RESISTANCE TO DETERMINE THE TEMPERATURE OF A METALLIZATION LINE
standard by JEDEC Solid State Technology Association, 02/01/2004

SERIAL FLASH DISCOVERABLE PARAMETERS (SFDP)
standard by JEDEC Solid State Technology Association, 07/01/2013

THERMAL TEST ENVIRONMENT MODIFICATIONS FOR MULTICHIP PACKAGES
standard by JEDEC Solid State Technology Association, 07/01/2008

TEMPERATURE, BIAS, AND OPERATING LIFE
standard by JEDEC Solid State Technology Association, 07/01/2017

SUGGESTED PRODUCT-DOCUMENTATION, CLASSIFICATIONS, AND DISCLAIMERS
standard by JEDEC Solid State Technology Association, 07/01/1996

STANDARD FOR DESCRIPTION OF LOW VOLTAGE TTL-COMPATIBLE CMOS LOGIC DEVICES
standard by JEDEC Solid State Technology Association, 11/01/1995

GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID / MCM PRODUCTS
standard by JEDEC Solid State Technology Association, 05/01/2002

JOINT IPC/JEDEC STANDARD FOR ACOUSTIC MICROSCOPY FOR NONHERMETRIC ENCAPSULATED ELECTRONIC COMPONENTS
standard by JEDEC Solid State Technology Association, 05/01/1999