CERAMIC PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES
standard by JEDEC Solid State Technology Association, 08/01/1993

IPC/JEDEC-9702: MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS (IPC/JEDEC-9702)
standard by JEDEC Solid State Technology Association, 06/01/2004

BALL GRID ARRAY PINOUTS STANDARDIZED FOR 16, 18, AND 20-BIT LOGIC FUNCTIONS USING A 54 BALL PACKAGE
standard by JEDEC Solid State Technology Association, 10/01/2001

POD125 – 1.25 V Pseudo Open Drain I/O
standard by JEDEC Solid State Technology Association, 06/01/2019

N-CHANNEL MOSFET HOT CARRIER DATA ANALYSIS
standard by JEDEC Solid State Technology Association, 09/01/2001

HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST)
standard by JEDEC Solid State Technology Association, 01/01/2009

RECOMMENDED ESD TARGET LEVELS FOR HBM/MM QUALIFICATION
standard by JEDEC Solid State Technology Association, 03/01/2012

CHARACTERIZATION AND MONITORING OF THERMAL STRESS TEST OVEN TEMPURATURES
standard by JEDEC Solid State Technology Association, 03/01/2014

TEMPERATURE CYCLING
standard by JEDEC Solid State Technology Association, 10/01/2014

IPC/JEDEC-9704: Printed Wiring Board (PWB) Strain Gage Test Guideline
standard by JEDEC Solid State Technology Association, 06/01/2005

DDR3 SDRAM Specification
standard by JEDEC Solid State Technology Association, 07/01/2012

Addendum No. 1 to 3D Stacked SDRAM
Amendment by JEDEC Solid State Technology Association, 12/01/2013