POD15 – 1.5 V Pseudo Open Drain I/O
standard by JEDEC Solid State Technology Association, 10/01/2009
LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD FOR LEADED SURFACE MOUNT PACKAGES
standard by JEDEC Solid State Technology Association, 08/01/1996
DEFINITION OF THE SSTU32864 1.8-V CONFIGURABLE REGISTERED BUFFER FOR DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 10/01/2004
TERMS, DEFINITIONS AND UNITS GLOSSARY FOR LED THERMAL TESTING
standard by JEDEC Solid State Technology Association, 05/01/2012
Addendum No. 1 to JESD79-4, 3D Stacked DRAM Standard
Amendment by JEDEC Solid State Technology Association, 02/01/2017
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
standard by JEDEC Solid State Technology Association, 11/01/2010
FBDIMM: ADVANCED MEMORY BUFFER (AMB)
standard by JEDEC Solid State Technology Association, 03/01/2009
BOND WIRE MODELING STANDARD
standard by JEDEC Solid State Technology Association, 06/01/1997
EMBEDDED MULTIMEDIACARD (e*MMC) PRODUCT STANDARD, HIGH CAPACITY
standard by JEDEC Solid State Technology Association, 07/01/2007
GUIDELINES FOR PACKING AND LABELING OF INTEGRATED CIRCUITS IN UNIT CONTAINER PACKING
standard by JEDEC Solid State Technology Association, 02/01/2006
JC-42.6 MANUFACTURER IDENTIFICATION (ID) CODE FOR LOW POWER MEMORIES
standard by JEDEC Solid State Technology Association, 03/01/2014
BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
standard by JEDEC Solid State Technology Association, 07/01/2003