GUIDELINES FOR REPORTING AND USING ELECTRONIC PACKAGE THERMAL INFORMATION
standard by JEDEC Solid State Technology Association, 05/01/2005

DEFINITION OF the SSTUB32865 28-bit 1:2 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 05/01/2007

SOLID STATE DRIVE (SSD) ENDURANCE WORKLOADS
standard by JEDEC Solid State Technology Association, 09/01/2010

PRECONDITIONING OF NONHERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
standard by JEDEC Solid State Technology Association, 11/01/2016

SEMICONDUCTOR POWER CONTROL MODULES
standard by JEDEC Solid State Technology Association, 11/01/1986

PHYSICAL DIMENSION
standard by JEDEC Solid State Technology Association, 06/01/2003

SEMICUSTOM INTEGRATED CIRCUITS (FORMERLY PUBLISHED AS STANDARD FOR GATE ARRAY BENCHMARK SET)
standard by JEDEC Solid State Technology Association, 06/01/1985

Overview of Methodologies for the Thermal Measurement of Single- and Multi-Chip, Single- and Multi-PN-Junction Light-Emotting Diodes (LEDs)
standard by JEDEC Solid State Technology Association, 04/18/2012

LOW FREQUENCY POWER TRANSISTORS
standard by JEDEC Solid State Technology Association, 01/01/1976

RELIABILITY QUALIFICATION OF SEMICONDUCTOR DEVICES BASED ON PHYSICS OF FAILURE RISK AND OPPORTUNITY ASSESSMENT
standard by JEDEC Solid State Technology Association, 01/01/2014

.05 Low Voltage Swing Terminated Logic (LVSTL05)
standard by JEDEC Solid State Technology Association, 06/01/2019

CONSTANT-TEMPERATURE AGING METHOD TO CHARACTERIZE COPPER INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING
standard by JEDEC Solid State Technology Association, 08/01/2017