JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES
standard by JEDEC Solid State Technology Association, 01/01/2007

Embedded Multi-media card (e*MMC), Electrical Standard 4.51
standard by JEDEC Solid State Technology Association, 06/01/2012

Embedded Multi-media card (e*MMC), Electrical Standard (4.5 Device)
standard by JEDEC Solid State Technology Association, 06/01/2011

A PROCEDURE FOR MEASURING P-CHANNEL MOSFET HOT-CARRIER-INDUCED DEGRADATION AT MAXIMUM GATE CURRENT UNDER DC STRESS
standard by JEDEC Solid State Technology Association, 09/01/2004

Component Quality Problem Analysis and Corrective Action Requirements (Including Administrative Quality Problems)
standard by JEDEC Solid State Technology Association, 07/01/2018

METAL PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES AND COVERS
standard by JEDEC Solid State Technology Association, 04/01/1987

GUIDELINE FOR RESIDUAL GAS ANALYSIS (RGA) FOR MICROELECTRONIC PACKAGES
standard by JEDEC Solid State Technology Association, 11/01/2011

JEDEC Dictionary of Terms for Solid-State Technology, Sixth Edition
standard by JEDEC Solid State Technology Association, 06/01/2013

GUIDELINE FOR RESIDUAL GAS ANALYSIS (RGA) FOR MICROELECTRONIC PACKAGES
standard by JEDEC Solid State Technology Association, 07/01/2002

ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TEST
standard by JEDEC Solid State Technology Association, 11/01/2018

Salt Atmosphere
standard by JEDEC Solid State Technology Association, 04/01/2013

DEFINITION OF THE SSTUB32869 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 05/01/2007