INTERFACE TEST METHOD FOR THE MEASUREMENT OF THE THERMAL RESISTANCE JUNCTION-TO-CASE OF SEMICONDUCTOR DEVICES WITH HEAT FLOW TROUGH A SINGLE PATH
standard by JEDEC Solid State Technology Association, 11/01/2010

GUIDELINE FOR DEVELOPING AND DOCUMENTING PACKAGE ELECTRICAL MODELS DERIVED FROM COMPUTATIONAL ANALYSIS
standard by JEDEC Solid State Technology Association, 05/01/1996

FBDIMM STANDARD: DDR2 SDRAM FULLY BUFFERED DIMM (FBDIMM) DESIGN SPECIFICATION
standard by JEDEC Solid State Technology Association, 03/01/2007

TEST BOARDS FOR THROUGH-HOLE PERIMETER LEADED PACKAGE THERMAL MEASUREMENTS
standard by JEDEC Solid State Technology Association, 07/01/2000

IPC/JEDEC-9703: Mechanical Shock Test Guidelines for Solder Joint Reliability
standard by JEDEC Solid State Technology Association, 03/01/2009

FLIP CHIP TENSILE PULL
standard by JEDEC Solid State Technology Association, 07/01/2014

METHOD OF DIODE Q MEASUREMENT
standard by JEDEC Solid State Technology Association, 11/01/1981

MEASUREMENT OF SMALL VALUES OF TRANSISTOR CAPACITANCE
standard by JEDEC Solid State Technology Association, 02/01/1967

SPECIAL REQUIREMENTS FOR MAVERICK PRODUCT ELIMINATION AND OUTLIER MANAGEMENT
standard by JEDEC Solid State Technology Association, 11/01/2008

HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST)
standard by JEDEC Solid State Technology Association, 07/01/2015

STANDARD FOR DESCRIPTION OF LOW-VOLTAGE TTL-COMPATIBLE BiCMOS LOGIC DEVICES
standard by JEDEC Solid State Technology Association, 05/01/1996

GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES
standard by JEDEC Solid State Technology Association, 09/01/2010