Reliability Qualification of Power Amplifier Modules
standard by JEDEC Solid State Technology Association, 03/01/2014
PRECONDITIONING OF PLASTIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
standard by JEDEC Solid State Technology Association, 10/01/2015
Serial Interface for Data Converters
standard by JEDEC Solid State Technology Association, 01/01/2012
Low Power Double Data Rate 5 (LPDDR5)
standard by JEDEC Solid State Technology Association, 02/01/2019
METHODOLOGY FOR THE THERMAL MEASUREMENT OF COMPONENT PACKAGES (SINGLE SEMICONDUCTOR DEVICE)
standard by JEDEC Solid State Technology Association, 12/01/1995
WIRE BOND SHEAR TEST
standard by JEDEC Solid State Technology Association, 04/01/2017
STANDARD TEST METHOD UTILIZING X-RAY FLUORESCENCE (XRF) FOR ANALYZING COMPONENT FINISHES AND SOLDER ALLOYS TO DETERMINE TIN (Sn) – LEAD (Pb) CONTENT
standard by JEDEC Solid State Technology Association, 03/01/2010
FBDIMM SPECIFICATION: HIGH SPEED DIFFERENTIAL PTP LINK AT 1.5 V
standard by JEDEC Solid State Technology Association, 03/01/2008
INTEGRATED CIRCUITS THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS – NATURAL CONVECTION (STILL AIR)
standard by JEDEC Solid State Technology Association, 01/01/2007
BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD ELECTRONIC PRODUCTS
standard by JEDEC Solid State Technology Association, 08/01/2018
STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS
standard by JEDEC Solid State Technology Association, 04/01/2011
STANDARD DESCRIPTION OF 1.2 V CMOS LOGIC DEVICES (NORMAL RANGE OPERATION)
standard by JEDEC Solid State Technology Association, 06/01/2001