IPC 2614
September 11, 2020
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This standard establishes the requirements for the documentation of printed circuit board fabrication, and identifies the physical attributes and performance requirements of the unpopulated product. The descriptions apply to rigid, flexible, inorganic substrates or any combination thereof. The construction may be single, double, multilayered, or HDI technology and may include embedded (integrated) components. The requirements pertain to both hard copy and electronic data descriptions.
Product Details
- Published:
- 03/01/2010
- Number of Pages:
- 59
- File Size:
- 1 file , 2.3 MB