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This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on achieving optimum functionality, process assessment, end-product reliability and repair issues associated with 3D semiconductor package assembly and processing.

Product Details

Published:

01/01/2023

ISBN(s):

9781638161134

Number of Pages:

104

File Size:

1 file , 7.8 MB

Note:

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