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Proceedings are from the symposium held May 6-7, 1999 in Santa Clara, CA. The success of high density component packages is dependent on a “meeting of the minds” of the semiconductor manufacturer, the packaging technologist, the printed board fabricator, the assembly engineer and others. This event presented new substrate technology, wafer level processes, PCB design strategies, assembly and reliability data. OEMs and manufacturers and suppliers to the CSP/BGA assembly industry attended this two day event.

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Published:

05/01/1999