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This test method is used to determine whether solid state devices can withstand the effect of the temperature shock to which they will be subjected during soldering of their leads in a solder wave process and/or solder fountain (rework/replacement) process. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.

Product Details

Published:

11/01/2016

Number of Pages:

14

File Size:

1 file , 54 KB